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Phihong introduces new high efficiency cost effective 120W single output AC/DC adapter series

Tue, 06 Feb 2024 14:24:21 GMT

January 19, 2024 Phihong introduces new high efficiency cost effective 120W single output AC/DC adapter series

Fremont, CA (January 19, 2024) — Phihong , a renowned supplier of reliable and cost-effective power conversion solutions, has announced the release of its new high efficiency AA120U series AC/DC desktop adapters rated up to 120 watts.

Housed in a splash-proof case measuring 5.9 x 2.56 x 1.38 inches, the AA120U series features an IEC 320 C14 inlet and meets mandatory U.S. DoE Level VI and EU Ecodesign 2019/1782 efficiency requirements, as well as the more stringent but voluntary European Code of Conduct Version 5 Tier 2 efficiency requirements. Additionally, as of the published date of this press release, the 24V, 48V and 54V output models comply with currently proposed US DoE Level VII requirements while a modified compliant (to Level VII) 12V model may be special ordered.

Ideal for telecommunications, consumer and industrial equipment applications and available in single DC output voltages of 12V, 24V, 48V and 54V, the AA120U series is Class I approved and operates up to +40 degrees C without derating. All AA120U models meets FCC, CAN ICES-003 and EN55032 Class B emissions limits, come standard with short circuit, over-current, over-voltage, and over-temperature protection features, bear UL, CE and UKCA compliance approvals to standard 62368-1 Edition 3, and are approved to 5,000 meters operating altitude.

“The attractively priced high efficiency AA120U adapters offer customers compelling value compared to other 120W desktop products on the market,” says Tom Chin, Senior Product Marketing Manager at Phihong USA.

To download the datasheet for Phihong’s AA120U AC/DC desktop adapter series visit: https://www.phihong.com/wp-content/uploads/AA120U.pdf .

Nexperia now offers GaN FETs in compact SMD packaging CCPAK for industrial and renewable energy applications

Tue, 06 Feb 2024 14:13:57 GMT

December 11, 2023 Nexperia now offers GaN FETs in compact SMD packaging CCPAK for industrial and renewable energy applications

December 11, 2023 Nijmegen -- Combining the benefits of copper-clip packaging and wide bandgap semiconductors

Nexperia today announced that its GaN FET devices, featuring next-gen high-voltage GaN HEMT technology in proprietary copper-clip CCPAK surface mount packaging, are now available to designers of industrial and renewable energy applications. Building on two decades of expertise in supplying high-volume, high-quality copper-clip SMD packaging, Nexperia is now proud to extend its revolutionary packaging approach to GaN cascode switches in CCPAK. The GAN039-650NTB, a 33 mΩ (typ.) Gallium Nitride (GaN) FET within the CCPAK1212i top-side cooling package, ushers in a new era of wide bandgap semiconductors and copper-clip packaging. This technology offers advantages for renewable energy applications such as solar and residential heat pumps, further enhancing Nexperia’s commitment to developing the latest component technology for sustainable applications. It is also suited to a wide spectrum of industrial applications such as servo drives, switched-mode power supplies (SMPS), server, and telecom.

Nexperia’s CCPAK surface mount packaging uses Nexperia’s proven innovative copper-clip package technology to replace internal bond wires. This reduces parasitic losses, optimizes electrical and thermal performance, and improves device reliability. For maximum flexibility in designs, these CCPAK GaN FETs are available in top- or bottom-cooled configurations to further improve heat dissipation.

The cascode configuration of the GAN039-650NTB enables it to deliver superior switching and on-state performance, with a robust gate offering high margins against noise. This feature also simplifies application designs by eliminating the requirement for complex gate drivers and control circuitry, instead allowing them to be conveniently driven using standard silicon MOSFET drivers. Nexperia’s GaN technology improves switching stability and helps to shrink die size by approximately 24%. In addition, device RDS(on) is reduced to only 33 mΩ (typ.) at 25°C, with a high threshold voltage and low diode forward voltage.

“Nexperia recognizes that designers of industrial and renewable energy equipment need a highly robust switching solution that can provide excellent thermal efficiency when performing power conversion.”, according to Carlos Castro, Vice President and General Manager of the GaN FET business at Nexperia. “This is why Nexperia decided to bring together the exceptional switching performance of its cascode GaN FETs with the exceptional thermal properties of its CCPAK packaging to offer customers a compelling solution.”

Nexperia begins its CCPAK portfolio release with the top-cooled 33 mΩ (typ.), 650 V GAN039-650NTB, and will follow shortly with the bottom-cooled variant, GAN039-650NBB of the same RDS(on). More information including datasheets and samples is available at www.nexperia.com/ccpak .

About Nexperia

Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every commercial electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia's commitment to innovation, efficiency, sustainability, and stringent industry requirements is evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.

For more information: https://www.nexperia.com/about/news-events/press-releases/Nexperia-now-offers-GaN-FETs-in-compact-SMD-packaging-CCPAK-for-industrial-and-renewable-energy-applications

Nexperia’s first SiC MOSFETs raise the bar for safe, robust and reliable power switching in industrial applications

Mon, 05 Feb 2024 14:17:07 GMT

November 30, 2023 Nexperia’s first SiC MOSFETs raise the bar for safe, robust and reliable power switching in industrial applications

November 30, 2023 Nijmegen -- Discrete 1200 V devices offer class-leading performance to accelerate global energy transition

Nexperia today announced its first silicon carbide (SiC) MOSFETs with the release of two 1200 V discrete devices in 3-pin TO-247 packaging with RDS(on) values of 40 mΩ and 80 mΩ. NSF040120L3A0 and NSF080120L3A0 are the first in a series of planned releases which will see Nexperia’s SiC MOSFET portfolio quickly expand to include devices with a variety of RDS(on) values in a choice of through-hole and surface mounted packages. This release addresses the market demand for the increased availability of high performance SiC MOSFETs in industrial applications including electric vehicle (EV) charging piles, uninterruptible power supplies (UPS) and inverters for solar and energy storage systems (ESS).

“With these inaugural products, Nexperia and Mitsubishi Electric wanted to bring true innovation to a market that has been crying out for more wide-bandgap device suppliers”, according to Katrin Feurle, Senior Director & Head of Product Group SiC at Nexperia. “Nexperia can now offer SiC MOSFET devices which offer best-in-class performance across several parameters, including high RDS(on) temperature stability, low body diode voltage drop, tight threshold voltage specification as well as a very well-balanced gate charge ratio making the device safe against parasitic turn on. This is the opening chapter in our commitment to producing the highest quality SiC MOSFETs in our partnership with Mitsubishi Electric. Together we will undoubtedly push the boundaries of SiC device performance over the coming years”.

“Together with Nexperia, we're thrilled to introduce these new SiC MOSFETs as the first product of our partnership”, says Toru Iwagami, Senior General Manger, Power Device Works, Semiconductor & Device Group in Mitsubishi Electric. “Mitsubishi Electric has accumulated superior expertise of SiC power semiconductors, and our devices deliver a unique balance of characteristics.”

RDS(on) is a critical performance parameter for SiC MOSFETs as it impacts conduction power losses. Nexperia identified this as a limiting factor in the performance of many currently available SiC devices and used its innovative process technology to ensure its new SiC MOSFETs offer industry-leading temperature stability, with the nominal value of RDS(on) increasing by only 38% over an operating temperature range from 25°C to 175°C. Unlike other many currently available SiC devices in the market.

Nexperia’s SiC MOSFETs also exhibit the very low total gate charge (QG), which brings the advantage of lower gate drive losses. Furthermore, Nexperia balanced gate charge to have an exceptionally low ratio of QGD to QGS, a characteristic which increases device immunity against parasitic turn-on.

Together with the positive temperature coefficient of SiC MOSFETs, Nexperia’s SiC MOSFETs offers also ultra-low spread in device-to device threshold voltage, VGS(th), which allows very well-balanced current-carrying performance under static and dynamic conditions when devices are operated in parallel. Furthermore, low body diode forward voltage (VSD) is a parameter which increases device robustness and efficiency, while also relaxing the dead-time requirement for asynchronous rectification and free wheel operation.

Nexperia is also planning the future release of automotive grade MOSFETs. The NSF040120L3A0 and NSF080120L3A0 are available in production quantities now. Please contact Nexperia sales representatives for samples of the full SiC MOSFET offering.

To learn more about Nexperia’s MOSFETs, visit: https://www.nexperia.com/sic-mosfets

Phihong releases ultra compact 60W USB-C , PD3.0 smart charger, utilizing GaN technology

Mon, 04 Dec 2023 14:26:52 GMT

December 4, 2023 Phihong releases ultra compact 60W USB-C , PD3.0 smart charger, utilizing GaN technology

Fremont, CA (December 4, 2023) — Phihong , a renowned supplier of reliable and cost-effective power conversion solutions, has announced the release of the AQ60W-59FKKA-R 60 watt gallium nitride (GaN) USB C Power Delivery 3.0 smart charger for portable electronics applications such as laptop computers, tablets, smart phones, Bluetooth speakers, and USB hubs.

The AQ60W-59FKKA-R, with its sleek design and high efficiency, offers the following features:

GaN technology to achieve a compact size of 2.29 x 2.29 x 1.1”.
USB C Power Delivery 3.0 with self-selecting 5V/3A, 9V/3A, 15V/3A, or 20V/3A output
An IEC 60320 C8 inlet receptacle designed for use with removable standardized power cords.
UL, CE, and UKCA compliance markings to standards UL 62368-1 and IEC 62368-1.
40°C operating temperature with no derating.
Compliance to DOE VI efficiency requirements and Europe’s Code of Conduct Version 5 Tier 2 efficiency requirements.
Compliance with FCC, CAN ICES-003/NMB-003, and EN 55032 Class B standards for both conducted and radiated emissions levels.

“By incorporating state of the art GaN technology, Phihong’s new AQ60W-59FKKA-R model delivers 60W of power in an incredibly small form factor. Unlike many of the unreliable USB-C chargers found in the market today, Phihong’s USB-C PD3.0 charger is guaranteed to operate at 60W with ambient operating temperature of 40°C and 5,000m altitude. With Phihong, consumers do not have to worry about potential electrical shocks or fire hazards in their homes or offices,” explains Tom Chin, Senior Product Marketing Manager at Phihong USA.

To download the datasheet for Phihong’s AQ60W-59FKKA-R visit: https://www.phihong.com/wp-content/uploads/AQ60W-59FKKA.pdf .

Micron Ships the Industry’s First 176-Layer QLC NAND in Volume and Unveils the 2400 PCIe Gen4 Client SSD

Mon, 14 Feb 2022 18:25:44 GMT

February 14, 2022

Micron Ships the Industry’s First 176-Layer QLC NAND in Volume and Unveils the 2400 PCIe Gen4 Client SSD

Micron Technology, Inc. (Nasdaq: MU), today announced it has begun volume shipments of the world's first 176-layer QLC NAND SSD. Built with the most advanced NAND architecture, Micron’s 176-layer QLC NAND delivers the industry’s leading storage density and optimized performance for a broad range of data-rich applications. Designed for use cases spanning client and data center environments, Micron’s transformative new NAND technology is now available with the introduction of the Micron 2400 SSD, the world’s first 176-layer PCIe Gen4 QLC SSD for client applications. The new 176-layer QLC NAND will also be incorporated into select Micron Crucial consumer SSDs, and available as a component for system designers.

Micron’s groundbreaking 176-layer QLC NAND provides a layer count and density unprecedented in QLC NAND flash and follows Micron’s delivery of the industry’s first 176-layer TLC NAND. Additionally, Micron’s 176-layer QLC NAND enables 33% higher I/O speed1 and 24% lower read latency2 than Micron’s prior generation solution. Its replacement-gate architecture is the only mass production QLC flash storage that combines charge trap with a CMOS-under-array design. These improvements are driving adoption of QLC SSDs in the client PC market, which is expected to triple QLC adoption by 2023, exceeding 35%, and reaching nearly 80% bit share in 2025.3

"Micron’s 2400 SSD builds upon our 176-layer NAND industry leadership to drive the transition to QLC-based storage for the client market,” said Jeremy Werner, corporate vice president and general manager of Micron’s Storage Business Unit. “Furthering our market leadership, we expect the new 2400 PCIe Gen4 SSD will significantly accelerate the adoption of QLC in client devices as it enables broader design options and more affordable capacity."

QLC NAND SSD for everyday computing

The Micron 2400 SSD delivers industry-leading storage density in a mainstream, value NVMe SSD to enable flexible OEM solution design and provide an uncompromising user experience. With 176-layer NAND and PCIe Gen4 technologies combined, the 2400 SSD doubles the performance of Micron’s previous generation client SSD and delivers 23% faster read time for accelerated boot and load times.4

The Micron 2400 SSD is also the world’s only 2TB 22x30mm M.2 SSD. This form factor shrinks the physical space required by 63% when compared with a 22x80mm M.2 form factor, providing design flexibility and making the drive ideal for small, mobile laptop designs. It is also available in 22x42mm and 22x80mm M.2 form factors, all with common firmware to minimize design qualification efforts.

The 2400 SSD provides a robust user experience across diverse use cases enabled in part by Micron’s Host Memory Buffer technology that allows the host to flexibly optimize performance. The SSD features low-power consumption for all-day, untethered computing, with active idle power being reduced by 50% from Micron’s previous generation solution. The Micron 2400 SSD is designed to meet Intel Project Athena requirements, enabling more than nine hours of real-world battery life on laptops even when using high-definition displays.

For more information: https://investors.micron.com/news-releases/news-release-details/micron-ships-industrys-first-176-layer-qlc-nand-volume-and

Melexis simplifies automotive electrification with high-speed inductive resolver for e-motors

Mon, 14 Feb 2022 18:25:42 GMT

January 28, 2022

Melexis simplifies automotive electrification with high-speed inductive resolver for e-motors

Melexis has developed a new inductive sensing IC intrinsically immune to stray magnetic fields. The MLX90510 inductive interface IC enables high-speed resolver minimizing the ECU effort required to get best-in-class accuracy under extreme mechanical and electrical conditions. With its superior EMC capabilities, the MLX90510 is perfect for e-motor control, e-brake booster and e-power steering applications.

Melexis, a global microelectronics engineering company, has introduced its first open market inductive sensor IC. The MLX90510 offers exceptional accuracy <+/-0.36° at up to 240,000 e-rpm. It is designed for demanding high speed sensing applications with high accuracy, EMC and safety requirements. It is intended for use in e-motor (e-axle), e-brake booster and e-power steering applications.

“An efficient electric powertrain requires the synchronization of the stator supply currents with the rotor position. This leads to optimal efficiency and torque characteristic control.” says Lorenzo Lugani, Product Manager Inductive Sensors at Melexis. “Thanks to the digital architecture and rugged design, automotive engineers take full advantage of the MLX90510 EMC robustness with minimal effort on the ECU side, resulting in module cost reduction.”

The MLX90510 offers differential sine and cosine analog outputs and is based on a digital architecture. It comprises Melexis’ patented tracking loop technology. This innovative architecture brings several advantages:

The system propagation delay is trimmed to 0ns with a maximum of +/-120ns residual variations over the entire operating temperature range.
Input offset compensation and zero output-angle position adjustment are performed within the IC, lowering the effort on the ECU.
The 3-phase based coil design simplifies linearity optimization.
Decoupling between the input and output enables unprecedented EMC performances. It also ensures stable output amplitudes independently from the airgap related input signal strength.
The linearization feature, with up to 16 calibration points, deals with the non-linearities of challenging sensor modes like side-of-shaft.

The MLX90510 works in combination with a set of PCB based coils whose scalable design can be easily adapted to the number of pole-pairs of the motor. Supporting multiple sensing modes for both on-axis (end-of-shaft) and off-axis (side-of-shaft or through-shaft) operation, the IC maximises flexibility in inductive coil designs to serve the most demanding mechanical constraints. With its overvoltage and reverse polarity protection (+/-24V on the supply and +/-18V on the outputs) the MLX90510 features excellent robustness against electrical challenges. In addition, the sensor is AEC-Q100 qualified for extended temperature operation from -40°C to +160°C. With full adherence to ISO 26262 ASIL-C functional safety guidelines, the MLX90510 supports up to ASIL-D system-level integration.

The MLX90510 is supplied in a RoHS TSSOP-16 package with samples available upon request.

For more information: www.melexis.com/MLX90510

KYOCERA AVX Launches TWA-Y Series: High-Temperature Wet Tantalum Capacitors Offering the World's Highest CV/cc 125V part at 200°C

Mon, 14 Feb 2022 18:25:37 GMT

January 3, 2022

KYOCERA AVX Launches TWA-Y Series: High-Temperature Wet Tantalum Capacitors Offering the World's Highest CV/cc 125V part at 200°C

The new 470µF/125V TWA-Y Series COTS-Plus capacitors have a leaded, cylindrical, and hermetically sealed T4-size case proven to reliably support 200°C operation for up to 2,000 hours and are ideal drop-in replacements for M39006-style capacitors in harsh industrial and downhole oil-drilling applications.

Unlike conventional wet electrolytic tantalum capacitors, KYOCERA AVX’s TWA-Y Series capacitors employ a unique cathode system that enables the highest CV/cc performance available on the market at 200°C at 125V in standard DLA case sizes spanning T1–T4. Featuring a hermetically sealed, welded tantalum can and header assembly and an optional insulation sleeve, TWA-Y Series capacitors ruggedly withstand harsh mechanical shock and high-frequency vibration per MIL-PRF-39006 and MIL-STD-202 (method 204, test condition “D” and method 213, test condition “I”) and exhibit stable electrical parameters over the full range of operating temperatures, extending from -55°C to +200°C.

For more information: https://datasheets.kyocera-avx.com/TWA-Y.pdf

Melexis announces a 20 W low noise single coil fan and pump driver for automotive applications

Mon, 28 Jun 2021 14:39:54 GMT

Tessenderlo, Belgium, 18 March 2021

Melexis, a global microelectronics engineering company, introduces the MLX9041 2-L as the automotive variant of the already well established MLX90412 .

The MLX90412-L is a dedicated automotive, all-in-one single-coil fan and pump driver IC, with a peak driving capability of 2.2 A. It is suitable for air pumps, water pump s, axial fans and radial and cross blower applications. Operating on a voltage ranging from 3.5 V to 32 V, and robust up to 40 V, the MLX90412 is well suited for any fan, blower or pump applications operating on 12 V (automotive) and 24 V (trucks) board nets. It is suitable for driving loads from 0.1 W up to 20 W.

The MLX90412-L is AECQ100 certified. It can be applied on the automotive battery without additional protection and survives load dump pulses up to 40 V. The operating junction temperature ranges from -40 °C to 150 °C. Typical applications include seat blower fans, battery cooling fan, DCDC converter cooling pumps or fans as well as HV inverter (IGBT/SIC cooling).

The MLX90412 offers unprecedented acoustic noise/vibration performance, making it a cost-effective alternative for applications which were previously considered exclusive to more expensive 3-phase solutions.

The MLX90412-L comes in a small Exposed pad DFN10 3x3 and is available for order.

For more information: https://www.melexis.com/en/news/2021/18mar2021-melexis-announces-a-20-w-low-noise-single-coil-fan-and-pump-driver

Micron’s Low-Power DDR5 DRAM Boosts Performance and Consumer Experience of Motorola’s New Flagship Edge+ Smartphone

website@sitemodify.com (Website Editor) — Mon, 28 Jun 2021 14:39:53 GMT

April 22, 2020 at 12:00 PM EDT

Collaboration key to unlocking the full potential of 5G in mobile devices

BOISE, Idaho and CHICAGO, April 22, 2020 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), together with Motorola, today announced integration of Micron’s low-power DDR5 (LPDDR5) DRAM into Motorola’s new motorola edge+ smartphone, bringing the full potential of the 5G experience to consumers. Micron and Motorola worked in close collaboration to enable the edge+ to reach 5G network speeds that require maximum processing power coupled with high bandwidth memory and storage.

With 12 gigabytes (GB) of industry-leading Micron LPDDR5 DRAM memory, motorola edge+ delivers a smooth, lag-free consumer experience. The new phone takes advantage of the faster data speeds and lower latency of 5G to increase the performance of cloud-based applications such as gaming and streaming entertainment.

“Our collaboration with Motorola on its flagship smartphone highlights the importance that mobile device manufacturers are placing on next-generation memory solutions that provide higher performance and richer consumer experiences,” said Dr. Raj Talluri, senior vice president and general manager of the Mobile Business Unit at Micron. “This announcement underscores how the mobile industry is coalescing behind Micron’s LPDDR5 for 5G flagship smartphone designs.”

Micron and Motorola Deliver Next-Gen Smartphone Features
Whether for photography, gaming, streaming or just browsing the web, consumers demand performance from a flagship smartphone, not delays. Micron’s LPDDR5 memory in the motorola edge+ unleashes more features to consumers

For more information: https://investors.micron.com/news-releases/news-release-details/microns-low-power-ddr5-dram-boosts-performance-and-consumer

AVX Releases New UBC 550 Series Ultra-Broadband Capacitors

website@sitemodify.com (Website Editor) — Mon, 28 Jun 2021 14:39:50 GMT

FOUNTAIN INN, S.C. May 20th, 2021

Optimized for high-performance, ultra-broadband microwave and millimeter-wave RF applications, the new UBC 550Z, 550U, and 550L Series capacitors have a rugged and compact single-piece, surface-mount, multilayer ceramic construction and exhibit ultra-low insertion loss, excellent return loss, flat frequency response, and high repeatability.

FOUNTAIN INN, S.C. (May 20th, 2021) – AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, has released new UBC 550 Series ultra-broadband capacitors designed to deliver reliable, repeatable performance from 16KHz to 70+GHz in ultra-broadband microwave and millimeter-wave RF applications with stringent operating requirements. The new UBC 550Z, 550U, and 550L Series ultra-broadband capacitors have a rugged and compact single-piece, surface-mount, multilayer ceramic construction made of the highest quality, RoHS-compliant materials and exhibit ultra-low insertion loss, excellent return loss, flat frequency response, and high unit-to-unit repeatability. These characteristics make the series ideally suited for use in DC blocking, coupling, bypassing, and feedback applications within optoelectronics, high-speed data networks, transimpedance amplifiers, broadband test equipment, synchronous optical networks (SONET), transmit and receive optical subassemblies (TOSA and ROSA), and other ultra-broadband microwave and millimeter-wave RF applications.

For more information: https://www.avx.com/news/ubc-550-series-ultra-broadband-capacitors

Quectel unveils SA800U-WF smart module

website@sitemodify.com (Website Editor) — Tue, 08 Dec 2020 22:28:28 GMT

December 4, 2020

Quectel Wireless solutions has launched its SA800U-WF premium smart module which features a built-in Android 9.0 or 10.0 operating system (OS).

Quectel Wireless solutions has launched its SA800U-WF premium smart module which features a built-in Android 9.0 or 10.0 operating system (OS). The new module features a high performance, low power 64-bit Octa-core applications processor and a variety of multimedia functions, plus built-in Wi-Fi and Bluetooth, making it ideal for both industrial and consumer applications that require powerful computing capability, multimedia functions and high data throughput.

The premium smart module's high-performance computing power makes it suitable for a wide range of processing-intensive applications including video enabled inventory management, videoconferencing, remote learning and remote video diagnostics. In addition, the multimedia capabilities coupled with the computing power mean the module is able to cope with the demands of emerging applications such as robotics, augmented reality, unmanned autonomous vehicles (UAV) and rich gaming.

For more information: https://www.quectel.com/infocenter/news/quectel-unveils-sa800u-wf-premium-smart-module.htm

Micron Introduces Industry's First 1TB Automotive and Industrial Grade PCIe NVMe™ Flash Storage

website@sitemodify.com (Website Editor) — Fri, 04 Dec 2020 22:03:50 GMT

October 8, 2020

Micron Technology, Inc. (Nasdaq: MU), today announced the launch of uMCP5, the industry’s first universal flash storage (UFS) multichip package with low-power DDR5 (LPDDR5) DRAM.

Micron Technology, Inc. (Nasdaq: MU), today announced the launch of uMCP5, the industry’s first universal flash storage (UFS) multichip package with low-power DDR5 (LPDDR5) DRAM. Now ready for mass production, Micron’s uMCP5 combines high-performance, high-density and low-power memory and storage in one compact package, equipping smartphones to handle data-intensive 5G workloads with dramatically increased speed and power efficiency. The multichip package uses Micron’s LPDDR5 memory, high-reliability NAND and leading-edge UFS 3.1 controller to power advanced mobile features previously only seen in costly flagship devices using discrete products, such as stand-alone memory and storage. Now available on other high-end phones, these emerging technologies — such as image recognition, advanced artificial intelligence (AI), multicamera support, augmented reality (AR) and high-resolution displays — are becoming accessible to more consumers.

“Moving 5G’s potential from hype to reality will require smartphones that can support the immense volumes of data flowing through the network and next-gen applications,” said Raj Talluri, senior vice president and general manager of Micron’s Mobile Business Unit. “Our uMCP5 combines the fastest memory and storage in a single package, unleashing new possibilities for 5G’s disruptive, data-rich technologies right at consumers’ fingertips.”

For more information: https://investors.micron.com/news-releases/news-release-details/micron-introduces-industrys-first-1tb-automotive-and-industria l?ReleaseID=1081884

AVX Joins The SPE Industrial Partner Network

Mon, 23 Nov 2020 22:03:50 GMT

November, 23, 2020

As a member of the SPE Industrial Partner Network, AVX will be actively involved in the continuing development of single-pair Ethernet (SPE) standards and compatible connectivity products.

AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, has joined the SPE Industrial Partner Network, a global association of companies dedicated to promoting Single-Pair Ethernet technology as the basis for the rapid and effective expansion of the Industrial Internet of Things (IIoT).

Single-Pair Ethernet (SPE) technology is much more than a simple collection of new electronic connectors and cabling solutions. It’s an entirely new architecture for data and power-over-data-line (PoDL) transmission that enables the rapid, reliable, and simultaneous delivery of both remote power and Ethernet data over a single compact and lightweight twisted-copper-wire pair. SPE technology has been successfully employed in the automotive industry since 2011 and is making the jump to Industry 4.0 and IIoT technologies that face similar demands for miniaturization, lightweighting, high-speed data, and power delivery, as well as the ability to ruggedly withstand environmental hazards including extreme temperatures, shock, vibration, and ingress. As such, it’s ideally suited for a wide variety of space- and weight-constrained applications with shorter cable runs and is not intended to replace the eight-wire Ethernet infrastructure that is currently employed in a multitude of cross-market applications and designed to support longer-distance transmission.

For more information: https://www.avx.com/news/avx-joins-the-spe-industrial-partner-network/